Notify me when new ads are posted. Please Contact. Older Mac computers. Taking offers. Powermac , G3 and G5. Bought new and still functional.
Have some older Mac keyboards, software, cables and networking peripherals. Sold all the older ones and still have these. Might sell my Commodore SX 64 if the price is right. Bought it new decades ago as a refurbished model. Have various disks, tv output adapter, etc.
Need your Apple device repaired? Cracked screen or other hardware issue? Specs: 1. PowerMac G5 Processor. Dual CPU 2Ghz. I can deliver it if necessary. Selling a Powermac G5.
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Works perfectly fine and has been restored to factory. Has mb of ram, an 80gb hard drive. I also have a 6tb Seagate Barracuda Pro hard drive that could be worked in to a deal. Could be used for parts or as it is! Accepting reasonable offers. Comes with just the computer, no monitor. In today's performance-driven environment memory upgrades provide an easy economical alternative to increase system performance.
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Every memory product Kingston offers is designed to help you get maximum performance. This memory is designed for Apple Power Mac G5 1. Apple Mac Pro Powermac G5. Great for a Mac User or for a Hackintosh Machine! The combination of Intel's cutting-edge 3-D tri-gate transistor technology and architectural enhancements help make possible up to double the 3-D graphics and HD media processing performance compared with Intel's previous generation of chips. With as much as 20 percent microprocessor performance improvements and new technologies to speed the flow of data to and from the chips, the new processors further extend Intel's overall performance leadership.
In the coming months, additional versions of the 3rd generation Intel Core processors will be available to power a new wave of systems ranging from Ultrabook TM devices, to servers and intelligent systems in retail, healthcare and other industries. Earlier microarchitectures added: pipeline , cache , floating-point unit , 2X or faster internal bus.
The P5 original Pentium microarchitecture implements the following improvements over the More efficient microcode control of pipeline for block copy and some other instructions Superscalar execution ability to run two instructions through separate pipelines provided they don't interfere with each other Faster math e. The Pentium M microarchitecture: Increases the L2 cache size Adds the SSE2 instructions Has a pipeline stages less than Netborst but still more than Pentium III Branch predictor now has global history Micro-ops fusion for more efficient handling of certain complex x86 instructions The Core microarchitecture: Adds the SSE3 instructions Expands cache interface to allow 2 cores to access a single L2 cache the cache is "shared" or "unified" Decreases pipeline to 12 stages always Core 2 is the new microarchitecture for 65 nm process, and the first microarchitecture since P5 to be used across the entire product line.
The Nehalem microarchitecture: Has more efficient macrofusion, loop stream detecting and branch prediction  Brings back hyperthreading larger reorder buffer and reservation station, twice as many user registers, etc Puts all cores on a single die as compared to Core 2 Quad Adds Turbo Boost , which increases the clock speed of those cores that are being used whenever one or more cores is idle.
All Haswell PCH's will be 32 nanometer. It will probably go to multi-chip modules across most of the product line as was done with Haswell for the "ultrabook" or ultra-low-power mobile segment and would support DDR4 officially, at least in higher-power variants such as mainstream desktop. Skylake is the new microarchitecture for 14nm. It will support DDR4 or an equivalent low-power variant across all products.
Skymont and Cannonlake are codenames I've found associated with 10nm, perhaps a die-shrink of Skylake. For the most part, each Intel microprocessor codename refers to a particular microarchitecture design on a particular process lithography feature size. This table summarizes the codenames, by process rows and microarchitectures columns :. Brand : Pentium 4 Pent. Each "Tick" is below the preceding "Tock", and the subsequent "Tock" is to its right. A "Tick" is the move to a smaller lithography, usually allowing for better power efficiency and sometimes added cache, or small feature enhancements that don't change the whole design examples: a few new instuctions to speed encryption, or adding PCIe 3.
According to Intel, their long-term goals in process technology development are to develop the next smaller size fitting twice the transistors in the same area every two years.
Because PowerPC is still running in my MAC
When a new process is just starting to be productive, existing designs are the best designs to try to produce, because it is already well-known how those designs respond to irregularities in lithographic steps and because existing designs make for a smaller die size than any newer, upcoming designs. A "Tock" is a new microarchitecture, allowing for better performance with roughly the same yield and transistor count, or for much better performance using a larger transistor count. Releasing a new microarchitecture only after the new lithography process has matured i.
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The "Tick-Tock" metaphor was first used by Intel marketing  in , but the pattern can be easily seen to extend back before that time. Each "tick" has come near the beginning of an even-numbered year, and until Sandy Bridge each "tock" came near the end of the same year. Thus the wait from a "tock" to the next "tick" is usually a bit longer.
Most of the codenames shown above are for the mainstream desktop variants, with the notable exception of Pentium M. The Pentium 4 and Pentium D microarchitecture design was abandoned when it became clear that the path towards the "terahertz transistor" was unsustainable due to heat dissipation, and the transition to "many" 4 or more power-efficient cores in the desktop CPU was inevitable.
I have included two non-Tock columns that I consider significant: the Pentium D first dual cores and the Core 2 Quad first quad cores. The Pentium D "Smithfield" was almost exactly two "Prescott" cores side by side on a die, linked to each other only through the shared front side bus that connects off-chip to the Northbridge. Similarly, a Core 2 Quad is little more than two Core 2 Duo dies in the same package, linked by the front side bus.
As of mid , the 22nm lithography process seems to be on-track for production, but I anticipate that the "Haswell" developments might be delayed a bit if 22nm takes longer to reach yield maturity. In such a case, another codename perhaps also ending in "bridge" might occupy a spot between Ivy Bridge and Haswell. If 22nm successfully reaches high yields in large scale production, the next pocess technology will be 16nm, which Intel as of their May 22 nanometer press event is still calling "14nm".
Power Mac G5 - Technical Specifications
P P? Sources: Wikipedia Transistor count , Pentium and other similar articles, see the Wikipedia references below , and some of the sources listed under the lithography table. This chart shows the variation between nominal transistor density as expressed by a technology name like "0. Based on the size of a chip and the number of transistors both are usually well-known, see list of sources after the table the density in transistors per square millimeter is computed by the formula:.
The area per transistor APT, in square nanometers is computed as:. Then the effective process size EPS, in nanometers can be computed by either of the following formulas:. The constant K 1 or K 2 is adjusted so that the effective process size, on average, corresponds to the official process size.
Currently K 1 is about and K 2 is about The product K 1 K 2 is , which is the number of nanometers in a millimeter. The discrepancy comes from the fact that one transistor in the design schematic, circuit layout, etc.